Styx s8030 SPI solder paste tester

1. Measurement principle: Programmable Phase Modulation Profile Measurement Technology (PSLM PMP)

2. Measurement items: volume, area, height, XY offset, shape, etc

3. Types of defects detected: low tin/high tin/missed printing, bridging, deviation, poor shape, board surface pollution, etc

4. Camera configuration: 4 million pixel ultra high frame industrial camera with a pixel size of 15um

5. Accuracy: 10um; Height: less than 1um

6. High repeatability accuracy:<1 μ M (4 Sigma);

7. Volume repeatability accuracy:<1% (4 Sigma)

8. Tin point repeatability accuracy: Gage R&R<10%

9. Detection speed: 0.45sec/FOV

10. Lighting source: 2D red/green/blue (R/G/B), 3D white/White

11. Mark point detection time: 0.3sec/pcs

12. Maximum measurement height: ± 350 μ M

13. Maximum measurement height of bent PCB: ± 5mm

14. Minimum pad spacing: 100um

15. Minimum measurement size: Rectangle: 150um; Circle: 200um

16. PCB size: 50 × 50-330 × 250mm

17. PCB thickness: 0.4-5mm

18. PCB weight: 0-3kg

19. PCB conveying height: 900 ± 40mm

20. SPC Statistical Data

21. Coordinate data import: Supports Gerber Data 274D/274X format, manual Teach mode CADX, Y, Part, etc