AOI optical inspection instrument

1. Testing items: Solder paste process, mounting process, process quality after reflow soldering, and wave soldering

2. Detection methods: Comprehensive weight imaging data difference analysis technology, color image comparison, color extraction analysis technology, similarity, binarization, OCR/OCV

Comprehensive application of various algorithms such as solder bead detection and pin analysis

4. Recognition features: Three MARK positioning correction, CAD import automatic compensation,

5. Detection coverage:

Solder paste printing: presence or absence, deviation, low/high tin content, open circuit, contamination; Part defects: missing parts, deviation, skewness, monument, side standing, flipping,

Wrong parts, damage, polarity reversal; Solder joint defects: excessive or insufficient tin, solder connection, copper foil contamination, etc. (in accordance with RoHS lead-free welding inspection)

Requirements);

B-wave soldering detection: excessive tin, insufficient tin, short circuit, soldering, sand hole.

6. Camera: Full digital high-speed CCD color 5 megapixel camera, resolution: 15 μ M

7. Light source: RGBB four element three color circular LED structure light source, special auxiliary coaxial light source

8. Platform driving device: AC servo motor system, camera moves in XY direction

9. Conveying system: substrate fixation method: bottom up fixation, and the ejector pin function can correct the bending of the large board. Automatic board entry and exit and automatic width modulation system, compliant with

SMEMA standard.

10. Transmission track height above ground: 900 ± 20mm

11. XY platform movement speed: 500mm/s

12. XY platform positioning accuracy: ＜ 10 μ M

13. PCB size: 50x50mm~400x330mm

14. PCB thickness: 0.3-3.0mm (warping ≤ 2mm, with fixture assisted correction system)

15. Minimum element: 15 μ M (CHIP: 01005. Pitch: 0.3mm)

16. Component height: ≤ 30mm above the PCB; PCB bottom ≤ 30mm